👋 About the Role
We're searching for a talented Advanced Package Design Engineer to join our team in Portugal! You'll play a key role in ensuring our Synopsys IP test chip packages meet the required performance standards.
🚀 What You'll Do
- Responsible for crafting advanced package designs, including silicon interposers, RDL fanout packages, and silicon bridge packages.
- Build and analyze models of advanced package designs, as well as their related PCB designs.
- Coordinate the various stages and workflow of package design.
- Find creative solutions to a wide variety of technical challenges.
- Keep your manager up-to-date on project progress.
- Represent the organization on business unit projects.
🔎 What We're Looking For
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Bachelor's degree in electrical or Electronic Engineering.
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At least 5 years of practical experience in a related field.
- A strong grasp of advanced circuit and transmission line theory.
- Experience with 3DIC packaging and 3D field solvers (e.g., HFSS).
- Excellent written and verbal English communication skills.
- Comfort working with both Windows and Linux operating systems.
➕ Nice-to-Have
- A can-do attitude, quick learning ability, and a solid foundation in electronics are definite pluses!
🏢 The Team
You'll be part of a global team that's highly skilled and supportive.
💼 About Synopsys Silicon IP
Our Silicon IP business focuses on integrating more features into System-on-Chips (SoCs) faster. We offer a wide range of silicon IP – predesigned blocks like logic, memory, interfaces, analog, security, and embedded processors. This helps our customers integrate more capabilities, meet unique performance, power, and size needs, and get their products to market faster with less risk.
Job Category: Hardware Engineering